The United States #semiconductor industry is projected to confront a substantial shortage of talent, with an anticipated deficit of 67,000 employees by 2030, according to the Semiconductor Industry Association (SIA). A reliance on foreign engineers, computer scientists, and technicians persists due to ongoing difficulties in cultivating local talent. The existing U.S. H-1B #visa system poses challenges for bringing in and retaining these workers, prompting the industry to call for a reevaluation of the system. To tackle this issue, a suggested remedy involves introducing a novel type of visa, named the “Chipmaker’s Visa,” specifically tailored for the semiconductor industry. This proposal, presented by the industry and the Economic Innovation Group (EIG), aims to streamline the talent acquisition process, underlining the urgency due to the industry’s critical role in national security and the broader economy. According to the proposed plan, the U.S. government would auction 10,000 visas annually, distributing 2,500 visas per quarter. The bidding price for these visas is based on a 2013 study, estimating a range of $5,000 to $10,000 per visa. Additionally, only companies with North American Industry Classification System (NAICS) codes related to chipmaking or suppliers would be eligible to participate in the bidding process.